Fraunhofer IPMS – AI-enabled miniaturised sensor technology
Fraunhofer Institute for Photonic Microsystems IPMS, together with the Helmholtz Centre for Environmental Research (UFZ) and the Center for Applied Research and Technology e.V. (ZAFT), is launching the FastSense research project – Innovative sensor technology and AI for environmental and hazardous substance monitoring. The project aims to develop a portable, fast measurement system combining state-of-the-art […]
Fraunhofer IPMS expects a new level of thin-film characterisation
The Fraunhofer Institute for Photonic Microsystems IPMS has launched the publicly funded SMut project, in collaboration with its partners Credoxys and SweepMe! to develop an innovative measurement system for precise thin-film characterisation. This system will enable experiments to be conducted under variable conditions, setting new standards in the characterisation of organic materials. Thin films in […]
VTT-originating startups attract €445M equity funding in 2025
In 2025, six VTT-originating startups secured a combined €445 million in equity funding. Notably, each of these funding rounds exceeded €10 million. The Finnish startup sector has grown to over 12.5 billion euros in turnover and offers high-value-added jobs to over 50.000 people. The year 2025 was record-breaking for Finnish deep tech companies that are […]
Imec launches university consortium around next-gen chips
Imec, a world-leading research and innovation hub in advanced semiconductor technologies, has launched a first-of-its-kind consortium with 26 European university groups that will jointly work on the technology roadmap beyond CMOS scaling (CMOS 2.0). This initiative will focus on design automation and chip architecture research for the next generation of chips. The consortium will benefit […]
Fraunhofer IPMS collaborates with Korean TSN Lab
The Fraunhofer Institute for Photonic Microsystems IPMS is working with the Korean TSN Lab on new real-time solutions as part of the “Global Cooperative R&D” funding programme. The aim is to develop a next generation of 10Base-T1S IP cores for automotive and industrial communication applications in order to address the growing demand for scalable and […]